The diagram illustrates the process of producing circuit boards.
Overall, the process can be divided into three primary stages: the preparation and cleaning of raw materials, the manufacturing and testing of the boards, and the final stage of packaging and delivery to factories.
The process starts with the delivery of raw circuit board materials for treatment. Initially, the materials are cut into the required sizes and coated with a fire-retardant substance to enhance their durability. After being treated, the boards are thoroughly cleaned before moving on to the next stages.
In the fourth stage, integrated circuits (IC) are attached automatically and then soldered onto the boards. The fifth stage involves visual inspection and quality control testing. At this point, there are two possible outcomes: if the chips fail the inspection and quality checks, they are discarded; however, if they pass the evaluation, they proceed to the final testing stage. At the final stage of the process, products that successfully pass quality control are packaged and then prepared for distribution to factories.