The given diagram illustrates the process of circuit board manufacturing. Overall, the entire procedure consists of three main phases, including: preparing material and cleaning, producing circuit boards and testing, and packaging and providing to factories.
The first step begins with delivery of circuit board materials to treatment. These materials are cut and sprayed with fire retardant, which make circuit boards more durable. The fire retardant materials are then cleaned before proceeding to the next stages.
Fabrication is the most important step in the circuit board production. The cleaned materials are channeled into Automated IC attachment and soldering process. Subsequently, they are visual inspection and quality control tested. Then, chips from rejected boards are thrown away. Eventually, these circuit boards are conveyed to the final testing. Here, circuit boards that meet standards will be taken to the next stage. Otherwise, substandard products are sent back to the beginning of production phase. Finally, the circuit boards that undergo final testing are packaged and delivered to factories.